| Materials |
| Matsushita Laminat | |
Advanced Resin Coated Copper None Halogenated ARCC R-0580 |
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Features  94V-0 without Halogenated derivatives Equivalent Properties with our conventional ARCC R0880 Product Line Up - Resin:60um, 80um / Copper:12um,18um |
Application For High Density Multilayer PWB Note PC, Hand held phone, Digital Video Camera, etc. |
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None Halogenated FR-4 for Multi Layer R-1566 (Thin core) R-1551(Prepreg) |
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Features 94V-0 without Halogenated derivatives Equivalent Properties with our FR-4 Product (R1766) Equivalent Processability with our FR-4 Product (R1766) |
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Application PC, Server, Base Station, HDD, Digital Video Cam. |
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| Entry and Backup Material | |
Entry Material |
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| EO-120 | 3003 H-19 Aluminum Laminated to a Pure Cellulose Core |
| SEO+ | 3003 H-19 Aluminum Laminated to a Pure Cellulose Core |
| Micro EO+ | 3003 H-19 Aluminum Laminated to a Pure Cellulose Core |
| EN 4000 | Epoxy-Resin Coated Cellulose Laminated to a Pure Cellulose Core |
| Micro EN | Epoxy-Resin Coated Cellulose Laminated to a Pure Cellulose Core |
| Aluminum | Fully Hardened Solid Aluminum |
| EFP Series | Flex Phenolic |
| EPP Series | Paper Phenolic |
| EMP Series | Melamine Clad Phenolic |
Backup Material |
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| VBU | 3003 H-19 Aluminum Laminated to a Corrugated 3003 H-19 Aluminum |
| Series 3000 | 3003 H-19 Aluminum Laminated to a High Quality Wood Core |
| ER 4000 | Epoxy-Resin Coated Cellulose Laminated to a High Quality Wood Core |
| PolarBack | White Epoxy-Resin Coated Quality Wood Core |
| BareBack | Epoxy-Resin Coated Quality Wood Core |
| Series 1800 | Cellulose Laminated to a High Quality Wood Core |
| BackBoard | Dry Process Manufactured Wood Fiber |
| BFP Series | Flex Phenolic |
| BPP Series | Paper Phenolic |
| BMP Series | Melamine Clad Phenolic |
| TCT | |
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| Taiyo | |
| Thermal cure type dielectric material for Build-Up board | |
HRP-700B (TR4525) Characteristics For package use (Including MCM). High thermal resistant type. High thermo-stability above method. High electrical properties. Excellent adhesion strength and stability without any physical surface treatment.HBI-200B TR3741 Characteristics For mother board use. Low halogen and high flame resistant type. Low material and process cost. Higher yield. High flame resistant with no halogen compound (UL under application, equivalent to 94V-0). Excellent heat stability, adhesion force to Cu plate above 1kg/cm. |
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| Thermal Curable Type Permanent Hole Plugging Ink | |
HBI-200 DB and HBI-200 DB4 Characteristics Excellent in thermal resistance reliability thank to Epoxy / Phenol resin. High content of inorganic filler realizes extra low expansion coefficient during thermal curing process. Having excellent/stable physical properties (Low moisture absorption, PCT resistance, etc). |
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| Liquid Photoimageable Etch Resist | |
PER-20 Approach to customer needs with high sensitivity and high resolution |
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Characteristics Low cost Scratch protection. High resolution. Easy chemicals control. |
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| Solder Mask for IC Packages | ||
Photo-Imaging for Plastic IC Package PSR-4000 AUS5 PSR-4000 AUS7 PSR-4000 AUS9 PSR-4000 AUS301 PSR-4000 AUS303 |
Photo-Imaging for Tape IC Package PSR-4000 AUS10 PSR-4000 AUS11 PSR-4000 AUS12 |
Thermal cure for IC Package S-50 S-500 |